JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices

Jedec is an association for solid state technology. Many standards are maintained by the JEDEC Association and the J-STD-020C is the standard for Moisture/Reflow for Components.

The purpose of the J-STD-020C standard is to identify the classification level of non-hermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. This standard may be used to determine what classification/preconditioning level should be used for SMD package qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability.

Xmultiple components are compliant with the Jedec J-STD-020C Standard. Solid State electronic components are simiconductors such as our Xmultiple product line of XTFZ transformers and magnetics. Other solid state components include transistors, microprocessors chips and the memory. Solid stae components have no nmoving parts and no dependency on electrical properties of a vacuum. Solid state components do have electromagnetic and quantum-mechanical action which takes place within the components..

JEDEC J-STD-020C Does Not Apply to Connectors --- However There Are Mositure Considerations For SMD Connectors Which Should Be Maintained.

Xmultiple XRJS and XMS series are a SMD (surface mount technology) typed RJ45 connector, which is built with SMD shaped pin-out for the customer to use in the IR reflow process. However, the JEDEC J-STD-020C standard applies to the solid state component category and not connectors.. The Solid State Component include silicon based components such as IC, DRAM, processor chips and flash memory. They do not have any moving parts.. Nevertheless, there is one issue related to the plastic housing being used in the XRJS and XMS series connectors which have moisture/reflow considerations. The plastic in these connectors is Nylon. The Nylon can absorb moisture in the storage stage and sometime the housing will be bumped up after the IR reflow process. Internal moisture is heated up by the IR process and therefore can bubble on the plastic.

• Xmultiple recommends for the XRJS and XMS series moisture considerations should be controlled by the customer.
  
• Customers of surface mount connectors should keep the connector in a well conditioned environment. First-in-first-out is also an important guide line for XRJS and XMS SMD typed connectors.
  
• The connector must be used within a period of time. As for the “solid state” category products the proper storage conditions must be maintained to eliminate moisture. Connectors should be keep in a dry storage area.

Xmultiple recomments all these factors are used with regard to the use of the surface mount products we manufacture.