Moisture Sensitivity Levels

   
 

From Xmultiple Engineering Dept.


IPC (Association Connecting Electronic Industries) created and released IPC-M-109, Moisture-sensitive Component Standards and Guideline Manual. Moisture Sensitivity Level relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (approximately 30¢XC/60%RH).

Increasingly, semiconductors have been manufactured in smaller sizes. Components such as thin fine-pitch devices and ball grid arrays could be damaged during SMT reflow when moisture trapped inside the component expands.

The expansion of trapped moisture can result in internal separation (delamination) of the plastic from the die or lead-frame, wire bond damage, die damage, and internal cracks. Most of this damage is not visible on the component surface. In extreme cases, cracks will extend to the component surface. In the most severe cases, the component will bulge and pop. This is known as the "popcorn" effect.

Moisture sensitive devices are packaged in a moisture barrier antistatic bag with a desiccant and a moisture indicator card which is vacuum sealed.

IPC-M-109 includes seven documents. According to IPC/JEDEC's J-STD-20: Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit (IC) SMDs, there are eight levels of moisture sensitivity. Components must be mounted and reflowed within the allowable period of time (floor life out of the bag).

Listed below are the MSL levels and the Jedec standard table with time and conditions. Xmultiple RJ connectors series without transformers are classified as MSL 1. For other connector types and series please contact us with the Xmultiple part number.


MSL 1 - Unlimited

MSL 2 - 1 year

MSL 2A - 4 weeks

MSL 3 - 168 hours

MSL 4 - 72 hours

MSL 5 - 48 hours

MSL 5A - 24 hours

MSL 6 - Mandatory Bake before use

 


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