Xmultiple Design Center
provides assistance with your connector and component
design requirements. Our engineers assist our customers
with their future product development, design, engineering,
manufacturing, and product fulfillment with immense
'in-house' capabilities. Xmultiple has the ability
to take an idea and turn it into a reality faster
and more cost effectively than any other interconnect
solutions Company. The 3D rendering above is our RJ45
and Dual USB (Type A) combination connection which
is also integrated with a MicroSD card reader which
is an Xmultiple patent pending technology. The MicroSD
connector optionally can be positioned vertically
to the right or left side of the RJ45 connector. New
ideas like our RJ45/MicroSD combo connectors (X-SMART)
can be created in a short amount of time for your
company as well.
USB Connector Series. Xmultiple X-SMART-USB
combo USB connector and a MicroSD card connector
integrated in one small form factor. This connector
is available in standard A and B, mini and micro
USB connector types.
have highly talented staff, and manufacturing facilities
worldwide which provide our customers with over 30
years' experience. Our 4,978,317 patent for RJ connectors
with integrated lights has become the standard for
RJ connectors. Xmultiple provides many tools for you
to use to assist in your product design and choices
to move those products to market. Listed below are
design tools and the links to each tool.
provides customer drawings for each part we manufacture.
In the event of a conflict between the specification
in a product sheet and the customer drawing, the customer
drawing takes precedence.
Guidelines for Printed Circuit Board Lay-Out
drawings provide the dimensions for printed circuit
board lay-out for our modular jacks and contact array.
When Side Entry or Contact Arrays are to be used it
is required to place gold plated finger tips on the
printed circuit board. When the free end part of the
contacts attach directly on the printed circuit board,
all through holes must be placed beyond the gold plated
finger tips of the printed circuit board. The through
holes must completely cover the solder mask rosin.
Avoid that tin, flux or any fluid can reach the finger
tips where electrical contact is established.
Guidelines for Panel Cut-Out Design
Entry Jack panel stops are to mechanical layouts which
lean against the inner side of the wall where it is
to be mounted. This panel cut-out is to prevent the
pull forces which will be produced by the modular
plug once it is inserted. This cut-out on the inner
side of the wall will reduce the loosening of the
contacts from the modular jack and also reduce the
stress which will be exerted upon the solder joints.
cut-out applies to any application where Contact Arrays
are to be used. When a modular plug is inserted the
housing where the contact array is mounted has to
prevent damage on the solder joints.
Modeling and System Integrity Overviews -
Xmultiple assist with your modeling and sumulation
Integrity Simulation and Requirements
(Simulation Program with Integrated Circuit Emphasis).
of the most common measuring tasks in RF engineering
is the analysis of circuits, from simple filters
and amplifiers to complex satellite communication
modules. As an extremely versatile test instrument,
a VNA is the ideal equipment for quickly and precisely
uncovering signal integrity problems, such as reflections
primer describes the fundamentals of vector network
analysis, as well as practical instructions for
improving accuracy, performing calibration, and
making typical linear and time-domain measurements.
Design Tools- Models
Design Automation - EDA
EDA Program with integrated Schematic Capture, PCB
layout and 3D modeling
Electronic design automation (EDA or ECAD) is a category
of software tools for designing electronic systems
such as printed circuit boards and integrated circuits.
The tools work together in a design flow that chip
designers use to design and analyze entire semiconductor
EDA specifically with respect
to integrated circuits.
EDA for electronics has rapidly increased in importance
with the continuous scaling of semiconductor technology.
Some users are foundry operators, who operate the
semiconductor fabrication facilities, or "fabs",
and design-service companies who use EDA software
to evaluate an incoming design for manufacturing readiness.
EDA tools are also used for programming design functionality
1. High-level synthesis (syn. behavioral synthesis,
algorithmic synthesis) For digital chips
Logic synthesis translation of abstract, logical language
such as Verilog or VHDL into a discrete netlist of
Schematic Capture For standard cell digital, analog,
rf like Capture CIS in Orcad by CADENCE and ISIS in
Layout like Layout in Orcad by Cadence, ARES in Proteus
1. Transistor simulation íV low-level transistor-simulation
of a schematic/layout's behavior, accurate at device-level.
Logic simulation íV digital-simulation of an RTL or
gate-netlist's digital (boolean 0/1) behavior, accurate
Behavioral Simulation íV high-level simulation of a
design's architectural operation, accurate at cycle-level
Hardware emulation íV Use of special purpose hardware
to emulate the logic of a proposed design. Can sometimes
be plugged into a system in place of a yet-to-be-built
chip; this is called in-circuit emulation.
Technology CAD simulates and analyzes the underlying
process technology. Electrical properties of devices
are derived directly from device physics.
Electromagnetic field solvers, or just field solvers,
solve Maxwell's equations directly for cases of interest
in IC and PCB design. They are known for being slower
but more accurate than the layout extraction above.
Clock Domain Crossing Verification (CDC check): Checks/tools
specialize in detecting and reporting potential issues
like data loss, meta-stability due to use of multiple
clock domains in the design.
Formal verification, also model checking: Attempts
to prove, by mathematical methods, that the system
has certain desired properties, and that certain undesired
effects (such as deadlock) cannot occur.
Equivalence checking: algorithmic comparison between
a chip's RTL-description and synthesized gate-netlist,
to ensure functional equivalence at the logical level.
Static timing analysis: Analysis of the timing of
a circuit in an input-independent manner, hence finding
a worst case over all possible inputs.
Physical verification, PV: checking if a design is
physically manufacturable, and that the resulting
chips will not have any function-preventing physical
defects, and will meet original specifications.
Mask data preparation, MDP: generation of actual lithography
photomask used to physically manufacture the chip.
Resolution enhancement techniques, RET íV methods of
increasing of quality of final photomask.
Optical proximity correction, OPC íV up-front compensation
for diffraction and interference effects occurring
later when chip is manufactured using this mask.
Mask generation íV generation of flat mask image from
Automatic test pattern generation, ATPG íV generates
pattern-data to systematically exercise as many logic-gates,
and other components, as possible.
Built-in self-test, or BIST íV installs self-contained
test-controllers to automatically test a logic (or
memory) structure in the design.
Center and Tools
- We assist our customer with all their connector
and LAN module component needs.