In keeping with the trend toward miniaturization, and especially diminishing board-to-board spacing, Xmultiple has become a leader in magnetic-materials manufacturing. Xmultiple offering advanced assembly procedures for magnetic connectors and for components. Xmultiple magnetics offer a low profile, good thermal characteristics, low leakage inductance, and good repeatability of properties.

Xmultiple uses its core technology to produce the integrated component transformer products. The data brochure for the Xmultiple component line gives complete curves of all magnetic parameters, including the frequency performance.

Xmultiple also uses multiple cores to produce a line of off-the-shelf and custom transformers. The Xmultiple XTFZ Series are available in many configurations with four isolated six- or eight-turn windings. You can connect the windings to accommodate a range of input voltages. The transformers can deliver as much as 200W dc at switching frequencies to 1 MHz with input voltages of 120 to 375V ac.

10GB Transformers with Integrated Shielding - Patent Pending

Ethernet is now running at 10 Gb rates, making it a viable option for high-speed interprocessor and I/O communications. The main problem with 10Gb designs are EMI considerations. Now there is a solution to the 10Gb EMI for products with the Xmultiple XTFZ internally shielded transformers.

Before the XTFZ transformers the metal shielding use with 10Gb products was external to the transformer component chip. The Xmultiple 10Gb XTFZ integrates the metal shielding inside the component itself so the metal shielding is contained inside the housing of component. Other elements of the component such as coils and contact pads and pins are also inside the component chip and the metal shielding is position inside to shield the coils in a manner to completely reduce the electromagnetic interference.

Cross List of Transformer Components

SFP Components

XTFZ Catalog